Wada O. (Ed.) Optoelectronic Integration: Physics, Technology and Applications

Springer / Kluwer Academic Publishers, 1994. — 465 p. — ISBN: 978-1-4615-2686-5.Optoelectronic devices and systems, along with electronics technology, have become indispensable in both our industrial and social lives, as represented by high-capacity optical fiber communication services and optical compact disk memories. Such opportunities have been realized by the mass production of high-performance, highly functional electronic ICs and optoelectronic devices. The ever increasing demand for equipment and services with more diversity and greater capacity will make optoelectronic integration, which combines two technologies, optoelectronics and electronics inevitable. During the last decade, intense research projects conducted through out the world have led to powerful advances in optoelectronic integration. However, at the time of this book's printing, there have been relatively few commercial products. This indicates that barriers which must be overcome to make this technology practical still exist.
Optoelectronic integration is the challenging merger of many different areas of science and technology. There have been numerous publications in specific areas, but they are limited in scope. This is the first book devoted to this topic. The aim of this book is to present the basic physics, materials, fabrication techniques, and systems applications of optoelectronic integration, in a concise and organized form so that engineers, scientists and students can grasp the essence of this emerging field. Because this technology is particularly diverse and dynamic, it is impossible to cover everything in a single volume. Therefore, our focus has been placed on reporting the accomplishments to date, and presenting the issues requiring future development in each of the major areas presented.
The first chapter is an overview, outlining this book's presentation of a broad variety of optoelectronic integration topics based on III-V semiconductors. Following the overview, three chapters discuss the basic physics and technologies required for device integration, materials growth, and processing. Then in the proceeding five chapters, areas of substantial device integration including OBICs, waveguide-based integrated circuits and two-dimensional optoelectronic functional devices are described in detail. The current status and future prospects of fabrication techniques and device applications are addressed in each area. The last few chapters describe packaging issues which are critical to practical applications and system aspects which are the driving force for integration technology. The chapters have been organized to allow independent use with extensive sets of references for additional reading. However, cross-referencing between chapters has been provided for cohesiveness.